TK529
国家自然科学基金(No.51706154)；黑龙江省科学(No.E2018011)
王志国,梁卫,杨文哲,等. 基于表征体元的空心型回填多孔结构导热模型[J]. 科学技术与工程, 2022, 22(25): 11012-11017.
Wang Zhiguo, Liang Wei, Yang Wenzhe, et al. Thermal conductivity model for hollow-type backfilled porous structures based on representative elementary volume[J]. Science Technology and Engineering,2022,22(25):11012-11017.
